TF2800 BGA and SMD Rework System
For decades, convective rework stations using resistance coil heating have handled BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201, and other bottom-terminated components. But today’s high thermal mass boards, fine-pitch parts, and demanding production lines require greater control, performance, and speed.
The PACE TF 2800 BGA/SMD Rework System meets these needs with its patented Inductive-Convection Heating Technology, allowing the top heater to reach target temperature in seconds for safe, rapid solder reflow in almost any application.
Features
- Ultra-Precise 28µm Placement Accuracy
- Revolutionary Inductive-Convection Heater
- Active Cooling Through Nozzle Provides Rapid Solder Cooldown
- 4 Thermocouple Inputs
- Adjustable Height Bottom-Side IR Preheater
- Board Support Beam
- Precision 24" x 24" PCB Holder
- Auxiliary Cooling Fan
- Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
- Single-Axis Operation
- Windows 10 Micro PC with 24" LCB Monitor
- Operator-Friendly Software Suite
- Made in the USA
Power Requirements
120 VAC, 50-60Hz (requires 20 A supply)|| 230 VAC, 50-60Hz (requires 10 A supply); 1600W maximum
Dimensions
737mm (29") H x 1118mm (44") W x 965mm (38") D
Weight (Without Computer)
90kg (200lbs)
Top-side Heater
Inductive-Convection Heater, 300 Watts
Bottom Side Heater
Medium/Long wave IR, 1900 Watts; 405mm (16") x 405mm (16") || (1 x 1000 Watts & 6 x 150 Watts)
Bottom Heater Adjustable Height
Can be raised up to 38mm (1.5") closer to the PCB
Active Cooling Capability
Offers swift, yet controlled component/PCB cooling, directly through the nozzle
High Sensitivity Vacuum Pick
Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)
Precision Placement Capability
Placement system utilizes a stepper motor and position encoding for precise movement
Placement Accuracy
28μm (.0011") accuracy
Integrated Board Support Beam
2 standard supports, 1 x support wand & 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.
Temperature Setting Range
Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
Max PCB Size
Maximum: 610mm x 610mm (24" x 24"); Minimum: N/A arms close down completely
Max/Min Component Size
Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.
Thermocouple Inputs
Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment
Vision Overlay System (VOS) with High Definition 1080p color camera
Vision Overlay System (VOS)
Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting
VOS Zoom Capability
Up to 240x zoom capability, with Stable Zoom and image stabilization
Quad-Field Imaging
Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
Single Axis Operation
All operations are complete in a single axis, eliminating risk of component movement after placement/reflow
Auxiliary Cooling Fan
Standard
Software
Intuitive, user-friendly, Windows software guides operators through profile development and execution
Computer System
Windows 10 PC, with wireless mouse and keyboard
Video Monitor
607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
Maximum Airflow
Self contained pump, PC controlled, adjustable up to 30 SLPM
Component Nests
Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
Heat Focusing, Vented Nozzles
Over 90 nozzles available
Flux Application Plate
Included; allows for automated flux dipping
PV-65 Pik-Vac Vacuum Wand
Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature
Warranty
One Year Limited Warranty