TF1800 BGA and SMD Rework System

For many years, convective rework stations using resistance coil heating have effectively handled the installation and removal of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201, and other bottom-terminated components. However, modern high thermal mass boards, ultra-fine pitch parts, and demanding rework environments now require higher precision, improved thermal performance, and faster throughput.
 
The PACE TF 1800 BGA/SMD Rework System delivers on these demands with its patented Inductive-Convection Heating Technology. Its top-side heater reaches the target temperature within seconds, ensuring safe and rapid solder reflow for virtually any component installation or removal task.