IR4100 Infrared BGA and SMD Rework Station
IR4100 Infrared BGA Rework Station
The IR4100 handles precise installation and removal of BGA, QFN, μBGA/CSP, Flip Chip, and other SMD components with ease. It features a 500W IR top heater and a 1900W bottom system (1×1000W central + 6×150W peripheral heaters) for even, controlled heat—no nozzles required.
A built-in IR pyrometer delivers non-contact, real-time temperature control, while the Sodr-Cam Reflow Camera lets you monitor the process live. The Windows-based software makes profiling simple, offering multi-stage profiles, real-time adjustments, and unlimited storage.
Designed for large PCBs up to 24”×24”, the IR4100’s independent bottom heaters and Board Support Beam prevent damage or warping, ensuring professional results every time.
Made in the USA.
120 VAC Unit Power Requirement
120 VAC, 50/60 Hz (2400 Watts maximum) Requires dedicated 20 A supply
230 VAC Unit Power Requirement
230 VAC, 50 Hz (2400 Watts maximum) Requires dedicated 10 A supply
Dimensions
737mm (29”) H x 1118mm (44”) W x 965mm (38”) D
Weight (Without Computer)
90kg (200lbs)
Bottom-side Preheater
Medium/Long wave IR, 1900 Watts with array of 7 IR emitters capable of preheating large, high mass assemblies
Adjustable Bottom Heater Working Height
Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB
Sensitivity Vacuum Pick
Pick is counterweight balanced,and utilizes an optical sensor and precision high temperature linear ball bearings ensuring delicate placement and pick up of parts from PCB. Includes six (6) Vacuum Picks
Precision Placement Capability
Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement
Placement Accuracy
Stepper motor with precision positioning of to 28μm (.0011") accuracy
Board Support Capability
Incorporates adjustable/removable Board Support Beam; Plus up to four stationary adjustable height support pins; Prevents PCBs from sagging/warping during rework
Maximum Target Temperature
Each profile zone has a maximum target temperature of 328 degrees C. (624 degrees F)
Precision PCB Holder
Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges
Maximum/Minimum PCB Size
Maximum: 610mm x 610mm (24” x 24”); Minimum: N/A
Maximum/Minimum Component Size
Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.
IR Pyrometer and Thermocouple Inputs
A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)
IR Pyrometer and Thermocouple Inputs
A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment System
Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom, and doesn't need routine calibration
Sodr- Cam
Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use.
Motorized Optics Housing
Automatically controlled, retractable optics housing protects Vision Overlay System from dirt and contamination
Quad-Field Imaging
For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
Single Axis Operation
All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow
Auxiliary Cooling Fan
Standard, for secondary cooling of the PCB
Software
Intuitive, user-friendly, Windows-compatible software guides operators through profile development and execution; No cost upgrades on IR3100/4100 software
Computer System
Windows 10 PC with wireless mouse/keyboard
Video Monitor
607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
Video Inputs
USB 3.0
Component Nests
Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
Flux Dip Plate
Included: allows for automated flux dipping
PV-65 Pik-Vac Vacuum Wand
Included: provides a manual vacuum pick-up capability for handling SMDs, incorporates new 15-minute auto-off feature
Warranty
One Year Limited Warranty