IR3100 Infrared BGA Rework Station
The IR3100 Infrared BGA Rework Station from Ksc Technology Solut is engineered to elevate your PCB repair precision. Empowering Your Tech Needs, One Chip at a Time, this advanced station ensures seamless, non-contact heating for intricate board repairs, minimizing risk while maximizing efficiency. Known for its user-friendly interface and reliability, it’s the go-to choice for professional technicians. Trust in the specialized solutions offered by Ksc Technology Solut to enhance your electronic repair capabilities and streamline your workflow with cutting-edge technology.
Power Requirements
120 VAC, 50/60 Hz (1550 Watts maximum)
230 VAC, 50 Hz (1550 Watts maximum)
Dimensions
737mm (29") H x 686mm (27") W x 737mm (29") D
Weight (Without Computer)
45kg (100lbs)
Top-side Heater
Medium/Long wave IR, 500 Watts
Bottom-side Preheater
Medium/Long wave IR, 1000 Wa
Bottom-side Preheater Working Height
Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB
High Sensitivity Vacuum Pick
Pick is counterweight balanced, and utilizes an optical sensor and precision high temperature linear ball bearings, ensuring delicate placement and pick up of parts from PCB. Includes six (6) Vacuum Picks
Precision Placement Capability
Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement.
Placement Accuracy
Stepper motor with precision positioning of to 28μm (.0011”) accuracy
Board Support Capability
Integrated Board Support Wand prevents PCBs from sagging/warping during rework and is adjustable to clear parts on bottom of PCB
Maximum Target Temperature
Each profile zone has a maximum target temperature of 328 °C (624 °F)
Precision PCB Holder
Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges
Maximum/Minimum PCB Size Maximum
305mm x 305mm (12” x 12”); Minimum: N/A arms close down completely.
Maximum/Minimum Component Size Maximum
65mm (2.5”) x 65mm (2.5”); Minimum: 1mm Sq.
IR Pyrometer and Thermocouple Inputs
A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment System
Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom capability and Stable Zoom.Motorized Optics Housing (Sodr-Cam
Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use.
Quad-Field Imaging
For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
Single Axis Operation
All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow.
Auxiliary Cooling Fan
Standard, for secondary cooling of the PCB
Component Nests
Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Optional component holding system for parts under 5mm Sq.
Flux Dip Plate
Included; allows for automated flux dipping