FineXT 6003

Large-Area Multi-Chip Production Die Bonder
FineXT 6003 is an advanced automated large-area volume production die bonder with true multi-chip, multi-placement for high-volume production.
Its modularity makes it possible to configure it with different advanced packaging technologies. Its performance can easily be upgraded to adapt to future technological direction in the semiconductor fabrication process. When integrated with an automatic tool management and material handling system, it gives high process flexibility for next-generation optoelectronics and demanding fan-out applications.
In reality, precision mode and speed mode can be balanced jointly. With the variability of precision requirement typically during multi-chip module assembly, this two-mode functionality ensures maximum throughput, making the FineXT 6003 a best-of-breed solution for modern semiconductor manufacturing facilities.
 
Placement accuracy of 3 µm
Very large bond area for wafers and panels
Multi wafer capability
Automatic placement accuracy calibration
Fully automatic material management
Automatic tool management
Adjustable Speed for Production
Multi-chip capability
Granite base and air bearings
Wide range of component presentation (wafer, waffle pack, gel-pak®)
Modular machine platform allows in-field retrofitting during entire service life
Synchronized control of all process related parameters
Numerous bonding technologies (adhesive, soldering, thermocompression)
Various bonding technologies in one recipe
Integrated scrubbing function
Individual configurations with process modules
Process and material traceability via TCP (for MES)
Full process access & easy visual programming with touch screen interface
Data/media logging and reporting function
3-color LED illumination
In-line capability with automatic substrate transport system