FINEPLACER femto pro

 
Automatic Multi-Purpose Bonder — FINEPLACER® femto pro
 
The FINEPLACER® femto pro is a fully automated, high-precision die bonder designed for advanced assembly tasks with lower cost-per-bond and higher throughput.
 
Performance & Accuracy: Placement accuracy of 2.0 µm @ 3 Sigma with a wide bonding force range, ideal for photonics, power electronics, and sensors.
Technology Spectrum: Supports multiple die attach methods including laser-assisted bonding, ultrasonic bonding, adhesive bonding, thermo-compression, eutectic, and reactive soldering.
Safety & Reliability: Full machine enclosure ensures process stability and protects operators from gas, vapor, and UV radiation.
Software & Control: Equipped with IPM Command software for synchronized process control, automated pattern recognition, and streamlined production flow.
Modular Design: Highly customizable and field-upgradable, offering a future-proof, cost-effective solution for evolving semiconductor assembly needs.
 
Multi-chip capability
Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
Wide range of controlled bonding forces
Placement accuracy of 2 µm @ 3 Sigma
Automatic placement accuracy calibration
Safe and controlled process environment with cleanroom quality
Various bonding technologies in one recipe
Wide range of supported component sizes
Overlay vision alignment system (VAS) with fixed beam splitter
Camera shifting for precision and wide field of view
In-situ process observation in HD
3-color LED illumination
Full process access and easy programming
Data/media logging and reporting function
Synchronized control of all process related parameters
Modular machine platform allows in-field retrofitting during entire service life
Ultra low bonding force
Process module compatibility across Finetech platforms
Individual configurations with process modules
Integrated scrubbing function
Fully automatic and manual operation
Automatic tool management
Wide range of component presentation (wafer, waffle pack, Gel-Pak®)
Large bonding area
Excellent price performance ratio