FINEPLACER femto 2

Advanced Automatic Sub-Micron Bonder
 
The FINEPLACER® femto 2 is a fully automated die bonder with 0.3 µm @ 3 sigma placement accuracy, designed for both prototyping and production. Its enclosed architecture ensures a stable, contamination-free environment for maximum yield and reliability in demanding applications.
 
This new generation platform integrates FPXvision™, an advanced vision alignment system with refined pattern recognition, providing unprecedented flexibility and precision. It also features IPM Command, a fully redesigned, ergonomic software interface for streamlined process development.
 
Thanks to its modular design, the FINEPLACER® femto 2 can be reconfigured or retrofitted anytime to support emerging technologies. Covering the full workflow—from inspection and packaging to final test and qualification—it serves as a robust solution for semiconductor, communications, medical, and sensor applications, effectively bridging the gap between R&D and high-volume production.
 
Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
Automatic placement accuracy calibration
Wide range of controlled bonding forces
UHD vision alignment system with FPXvisionTM
Multi-chip capability
Safe and controlled process environment with cleanroom quality
Wide range of component presentation (wafer, waffle pack, gel-pak®)
Modular machine platform allows in-field retrofitting during entire service life
Large bonding area
Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
Ultra low bonding force
Individual configurations with process modules
Various bonding technologies in one recipe
Integrated scrubbing function
Process module compatibility across Finetech platforms
Wide range of supported component sizes
Synchronized control of all process related parameters
Process and material traceability via TCP (for MES)
Full process access & easy visual programming with touch screen interface
Data/media logging and reporting function
3-color LED illumination
In-situ process observation in HD
Fully automatic and manual operation
Automatic tool management